BH GSO IEC 60191-5:2016

IEC 60191-5:1997
Bahraini Standard   Current Edition · Approved on 10 February 2016

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

BH GSO IEC 60191-5:2016 Files

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BH GSO IEC 60191-5:2016 Scope

This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

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